The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 13, 2018
Filed:
May. 28, 2015
Dow Corning Toray Co., Ltd., Tokyo, JP;
Tomohiro Iimura, Ichihara, JP;
Nohno Toda, Ichihara, JP;
Sawako Inagaki, Ichihara, JP;
Yusuke Miyamoto, Ichihara, JP;
Haruhiko Furukawa, Ichihara, JP;
DOW CORNING TORAY CO., LTD., Tokyo, JP;
Abstract
An organosilicon compound represented by the general formula, a hydrosilylation-curable silicone composition containing the compound as an adhesion promoter, and a semiconductor device having a semiconductor element sealed with a cured product of the composition. To provide a novel organosilicon compound, a curable silicone composition that contains the organosilicon compound as an adhesion promoter, has excellent initial adhesion and adhesion durability to a base material such as an organic resin, and forms a cured product having high light transmittance, and a highly reliable semiconductor device produced using this composition.