The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 06, 2018

Filed:

Feb. 23, 2018
Applicant:

Unimicron Technology Corp., Taoyuan, TW;

Inventors:

Wei-Ti Lin, Hsinchu, TW;

Chun-Hsien Chien, Hsinchu, TW;

Fu-Yang Chen, Hsinchu, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/16 (2006.01); H05K 3/10 (2006.01); H05K 1/18 (2006.01); H05K 1/02 (2006.01); H01F 27/06 (2006.01); H05K 1/03 (2006.01); H05K 3/00 (2006.01); H01F 41/04 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 1/165 (2013.01); H01F 27/06 (2013.01); H01F 41/041 (2013.01); H05K 1/0298 (2013.01); H05K 1/0306 (2013.01); H05K 1/115 (2013.01); H05K 1/188 (2013.01); H05K 3/0011 (2013.01); H05K 3/10 (2013.01); H01F 2027/065 (2013.01);
Abstract

A circuit board structure including an insulating layer, first and second dielectric layers, and first and second inductors is provided. The insulating layer includes a first surface, a second surface, and a first conductive through hole. The first dielectric layer is disposed on the first surface. The first inductor is disposed on the first surface and includes a first conductive coil in a solenoid form penetrating the first dielectric layer and a first magnetic flux axis of which the direction is substantially parallel to the first surface. The second dielectric layer is disposed on the second surface. The second inductor is disposed on the second surface and includes a second conductive coil in a solenoid form penetrating the second dielectric layer and a second magnetic flux axis of which the direction is substantially parallel to the second surface. A manufacturing method of a circuit board structure is provided.


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