The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 06, 2018

Filed:

Dec. 22, 2015
Applicant:

Intel Ip Corporation, Santa Clara, CA (US);

Inventors:

Thorsten Meyer, Regensburg, DE;

Andreas Augustin, Munich, DE;

Reinhard Golly, Ottobrunn, DE;

Peter Baumgartner, Munich, DE;

Assignee:

Intel IP Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04B 5/00 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H04B 5/0081 (2013.01); H01L 23/528 (2013.01); H01L 23/5227 (2013.01); H01L 25/0657 (2013.01); H04B 5/0031 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/1703 (2013.01); H01L 2225/06513 (2013.01); H01L 2924/15311 (2013.01);
Abstract

Apparatus and methods are provided for wireless communications between integrated circuits or integrated circuit dies of an electronic system. In an example, an apparatus can include a first integrated circuit die including a plurality of integrated circuit devices, a second integrated circuit die including a second plurality of integrated circuit devices, and a conductor device configured to wirelessly receive a signal from the first integrated circuit die, to conduct the signal from a first end of an electrical conductor of the conductor device to a second end of the electrical conductor, and to wirelessly transmit the signal to the second integrated circuit die from the second end of the electrical conductor.


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