The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 06, 2018
Filed:
Nov. 27, 2015
Applicant:
Unimicron Technology Corp., Taoyuan, TW;
Inventor:
Cheng-Jui Chang, Taoyuan, TW;
Assignee:
Unimicron Technology Corp., Taoyuan, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H05K 1/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/45 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 24/85 (2013.01); H05K 1/00 (2013.01); H01L 2224/13007 (2013.01); H01L 2224/13026 (2013.01); H01L 2224/4502 (2013.01); H01L 2224/45005 (2013.01); H01L 2224/45015 (2013.01); H01L 2224/8592 (2013.01);
Abstract
A pillar structure is disposed on a substrate. The pillar structure includes a pad, a metal wire bump, a metal wire, and a metal plating layer. The pad is disposed on the substrate. The metal wire bump is disposed on the pad. The metal wire is connected to the metal wire bump. The metal wire extends in a first extension direction, the substrate extends in a second extension direction, and the first extension direction is perpendicular to the second extension direction. The metal plating layer covers the pad and completely encapsulates the metal wire bump and the metal wire.