The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 06, 2018

Filed:

Jun. 13, 2017
Applicant:

Disco Corporation, Tokyo, JP;

Inventor:

Koichi Shigematsu, Tokyo, JP;

Assignee:

Disco Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/822 (2006.01); H01L 21/304 (2006.01); H01L 21/683 (2006.01); B28D 5/02 (2006.01); H01L 21/78 (2006.01); H01L 21/67 (2006.01); H01L 21/268 (2006.01);
U.S. Cl.
CPC ...
H01L 21/3043 (2013.01); B28D 5/022 (2013.01); H01L 21/67092 (2013.01); H01L 21/67288 (2013.01); H01L 21/6836 (2013.01); H01L 21/78 (2013.01); H01L 21/822 (2013.01); H01L 21/2683 (2013.01); H01L 2933/0033 (2013.01);
Abstract

There is provided a cutting method for cutting a processing-target object by a cutting blade. The cutting method includes a holding step of holding the processing-target object by a holding table and a cutting step of cutting the processing-target object by the cutting blade by causing the cutting blade that rotates to cut into the processing-target object held by the holding table and causing the holding table and the cutting blade to relatively move after the holding step is carried out. In the cutting step, cutting is carried out with detection of whether or not a crack in the processing-target object exists by a crack detecting unit disposed on the rear side relative to the cutting blade in a cutting progression direction in which cutting processing of the processing-target object by the cutting blade progresses.


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