The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 06, 2018

Filed:

Oct. 05, 2016
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Dong-young Lee, Asan-si, KR;

Byoung-jun Min, Asan-si, KR;

Jong-cheol Lee, Cheonan-si, KR;

Assignee:

SAMSUNG ELECTRONICS CO., LTD., Samsung-ro, Yeongtong-gu, Suwon-si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/02 (2006.01); G01R 31/26 (2014.01); G01R 31/28 (2006.01); G01R 1/02 (2006.01); G01R 1/04 (2006.01); G01R 35/00 (2006.01); G01R 31/317 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2601 (2013.01); G01R 31/2875 (2013.01); G01R 31/2893 (2013.01); G01R 31/31718 (2013.01);
Abstract

A semiconductor test apparatus includes: a tray housing unit configured to house a customer tray loading untested semiconductor chips, secondary semiconductor chips, and non-defective semiconductor chips; a loader configured to locate the untested semiconductor chips supplied from the tray housing unit on a loading set plate and load the untested semiconductor chips onto a test tray; a tester configured to test semiconductor chips loaded on the test tray; an unloader configured to unload semiconductor chips loaded on the test tray, classify the tested semiconductor chips, and locate the classified semiconductor chips on an unloading set plate; and a retest controller configured to transfer the secondary defective semiconductor chips and the non-defective semiconductor chips to the tray housing unit and transfer the first defective semiconductor chips to the loading set plate.


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