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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10119047 B1

PDFFull Text
Date of Patent:
Nov. 06, 2018

Filed:

Mar. 31, 2015

Thermosetting resin composition, and prepreg, insulating film with support, laminate plate, and printed wiring board, each obtained using same

Applicant:

Hitachi Chemical Company, Ltd., Tokyo, JP;

Inventors:

Tomohiko Kotake, Ibaraki, JP;

Shinji Tsuchikawa, Ibaraki, JP;

Hiroyuki Izumi, Ibaraki, JP;

Masato Miyatake, Ibaraki, JP;

Shin Takanezawa, Ibaraki, JP;

Hikari Murai, Ibaraki, JP;

Tetsurou Irino, Ibaraki, JP;

Assignee:

HITACHI CHEMICAL COMPANY, LTD., Tokyo, JP;

Attorney:

Fitch, Even, Tabin & Flannery, L.L.P.

Primary Examiner:

Lynda Salvatore

Int. Cl.
CPC ...
C08L 63/00 (2006.01); C09D 179/08 (2006.01); B32B 27/38 (2006.01); C08J 5/24 (2006.01); H05K 1/03 (2006.01); B32B 15/14 (2006.01); C08G 59/50 (2006.01); C08L 79/08 (2006.01); C09D 163/00 (2006.01); B32B 5/02 (2006.01); B32B 5/24 (2006.01); B32B 27/06 (2006.01); B32B 27/18 (2006.01); B32B 27/20 (2006.01); B32B 27/28 (2006.01); B32B 27/32 (2006.01); B32B 27/36 (2006.01); B32B 27/42 (2006.01);
U.S. Cl.
CPC ...
C09D 179/085 (2013.01); B32B 5/02 (2013.01); B32B 5/24 (2013.01); B32B 15/14 (2013.01); B32B 27/06 (2013.01); B32B 27/18 (2013.01); B32B 27/20 (2013.01); B32B 27/281 (2013.01); B32B 27/283 (2013.01); B32B 27/325 (2013.01); B32B 27/36 (2013.01); B32B 27/38 (2013.01); B32B 27/42 (2013.01); C08G 59/5073 (2013.01); C08J 5/24 (2013.01); C08L 63/00 (2013.01); C08L 79/085 (2013.01); C09D 163/00 (2013.01); H05K 1/0353 (2013.01); B32B 2260/021 (2013.01); B32B 2260/023 (2013.01); B32B 2260/046 (2013.01); B32B 2264/102 (2013.01); B32B 2307/306 (2013.01); B32B 2307/50 (2013.01); B32B 2307/536 (2013.01); B32B 2307/714 (2013.01); B32B 2307/7265 (2013.01); B32B 2457/08 (2013.01); Y10T 428/24802 (2015.01); Y10T 428/249921 (2015.04); Y10T 428/31721 (2015.04); Y10T 442/2721 (2015.04);
Abstract

A thermosetting resin composition containing: (A) a resin composition having an unsaturated maleimide group, produced by reacting (a) a maleimide compound having at least two N-substituted maleimide groups per one molecule and (b) an amine compound having at least two primary amino groups per one molecule, in an organic solvent; (B) a thermosetting resin; and (C) a modified imidazole compound, such as an isocyanate-masked imidazole and an epoxy-masked imidazole, and a prepreg, an insulating film with a support, a laminate plate and a printed wiring board, each containing the same.

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