The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 30, 2018

Filed:

Oct. 26, 2015
Applicant:

Shinko Electric Industries Co., Ltd., Nagano-shi, Nagano, JP;

Inventors:

Kentaro Kaneko, Nagano, JP;

Toshimitsu Omiya, Nagano, JP;

Kotaro Kodani, Nagano, JP;

Junichi Nakamura, Nagano, JP;

Kazuhiro Kobayashi, Nagano, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/02 (2006.01); H05K 3/10 (2006.01); H05K 3/18 (2006.01); H05K 1/11 (2006.01); H05K 3/46 (2006.01); H01L 23/00 (2006.01); H01L 23/544 (2006.01); H01L 21/683 (2006.01); H01L 23/13 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); C25D 5/02 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 3/188 (2013.01); C25D 5/022 (2013.01); H01L 21/4857 (2013.01); H01L 21/6835 (2013.01); H01L 23/13 (2013.01); H01L 23/49822 (2013.01); H01L 23/544 (2013.01); H01L 24/16 (2013.01); H01L 24/81 (2013.01); H05K 1/113 (2013.01); H05K 3/0017 (2013.01); H05K 3/46 (2013.01); H05K 3/4682 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68381 (2013.01); H01L 2223/54426 (2013.01); H01L 2223/54486 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81193 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/92125 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/15311 (2013.01); H05K 2201/0376 (2013.01); H05K 2201/09036 (2013.01); H05K 2203/0369 (2013.01); H05K 2203/0376 (2013.01); H05K 2203/06 (2013.01); Y10T 29/49155 (2015.01);
Abstract

A wiring substrate includes an insulating layer, a connection pad buried in the insulating layer in a state that an upper surface of the connection pad is exposed from an upper surface of the insulating layer and a lower surface and at least a part of a side surface of the connection pad contact the insulating layer, and a concave level difference portion formed in the insulating layer around an outer periphery part of the connection pad, wherein an upper surface of the connection pad and an upper surface of the insulating layer are arranged at a same height.


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