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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10116285 B1

PDFFull Text
Expired
Date of Patent:
Oct. 30, 2018

Filed:

Jan. 19, 2017

Integration of a replica circuit and a transformer above a dielectric substrate

Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Je-Hsiung Lan, San Diego, CA (US);

Chi Shun Lo, San Diego, CA (US);

Jonghae Kim, San Diego, CA (US);

Mario Francisco Velez, San Diego, CA (US);

John H. Hong, San Clemente, CA (US);

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorney:

Qualcomm Incorporated-Toler

Primary Examiner:

Stephen E Jones

Assistant Examiner:

Scott S Outten

Int. Cl.
CPC ...
H03H 11/28 (2006.01); H01L 27/12 (2006.01); H01L 23/522 (2006.01); H01L 23/66 (2006.01); H01L 49/02 (2006.01); H01F 41/02 (2006.01); H01L 27/13 (2006.01); H01L 23/64 (2006.01); H01F 19/08 (2006.01); H01F 27/28 (2006.01);
U.S. Cl.
CPC ...
H03H 11/28 (2013.01); H01F 41/02 (2013.01); H01L 23/5227 (2013.01); H01L 23/66 (2013.01); H01L 27/1218 (2013.01); H01L 27/1255 (2013.01); H01L 27/1259 (2013.01); H01L 27/13 (2013.01); H01L 28/10 (2013.01); H01F 2019/085 (2013.01); H01F 2027/2809 (2013.01); H01L 23/645 (2013.01); H01L 27/1225 (2013.01); H01L 2223/6655 (2013.01); H01L 2223/6672 (2013.01); H01L 2223/6677 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/30111 (2013.01);
Abstract

A method includes forming a replica circuit above a surface of a glass-type material. The replica circuit includes a thin-film transistor (TFT) configured to function as a variable capacitor or a variable resistor. The method further includes forming a transformer above the surface of the glass-type material. The transformer is coupled to the replica circuit, and the transformer is configured to facilitate an impedance match between the replica circuit and an antenna.

Find Patent Forward Citations

Lan, Je-Hsiung. (2018). Integration of a replica circuit and a transformer above a dielectric substrate (U.S. Patent No. 10116285). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10116285

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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