The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 30, 2018

Filed:

Feb. 28, 2017
Applicant:

Sandisk Technologies Llc, Plano, TX (US);

Inventors:

Jongsun Sel, Pleasanton, CA (US);

Daewung Kang, Los Gatos, CA (US);

Michiaki Sano, Ichinomiya, JP;

Yohei Yamada, Nagoya, JP;

Mitsuteru Mushiga, Kuwana, JP;

Tuan Pham, San Jose, CA (US);

Assignee:

SanDisk Technologies LLC, Addison, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 27/115 (2017.01); H01L 21/8234 (2006.01); H01L 27/24 (2006.01); H01L 45/00 (2006.01); H01L 29/78 (2006.01); H01L 21/306 (2006.01);
U.S. Cl.
CPC ...
H01L 27/2454 (2013.01); H01L 21/30604 (2013.01); H01L 21/823437 (2013.01); H01L 21/823475 (2013.01); H01L 27/115 (2013.01); H01L 27/2481 (2013.01); H01L 29/78 (2013.01); H01L 45/1206 (2013.01); H01L 45/1233 (2013.01); H01L 45/145 (2013.01); H01L 45/1608 (2013.01); H01L 45/1675 (2013.01); H01L 45/1683 (2013.01);
Abstract

A method is provided that includes forming a dielectric material and a first sacrificial material above a substrate, forming a second sacrificial material above the substrate and disposed adjacent the dielectric material and the first sacrificial material, forming a first hole in the second sacrificial material, the first hole disposed in a first direction, forming a word line layer above the substrate via the first hole, the word line layer disposed in a second direction perpendicular to the first direction, forming a first portion of a nonvolatile memory material on peripheral sides of the word line layer via the first hole, forming a second hole in the second sacrificial material, forming a second portion of the nonvolatile memory material on a sidewall of the second hole, forming a local bit line in the second hole, and forming a memory cell including the nonvolatile memory material at an intersection of the local bit line and the word line layer.


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