The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 30, 2018

Filed:

Dec. 24, 2015
Applicant:

Siliconware Precision Industries Co., Ltd., Taichung, TW;

Inventors:

Shao-Chueh Hu, Taichung, TW;

Yueh-Chiung Chang, Taichung, TW;

Don-Son Jiang, Taichung, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/11 (2006.01); H05K 7/02 (2006.01); H01Q 3/44 (2006.01);
U.S. Cl.
CPC ...
H01L 25/117 (2013.01);
Abstract

An electronic module is provided, which includes a first package and a second package stacked on the first package. The first package has an encapsulant and an electronic element embedded in the encapsulant. The second package has an insulating layer and an antenna structure formed on and extending through the insulating layer. The insulating layer is bonded to the encapsulant with the antenna structure being electrically connected to the electronic element. Since the second package having the antenna structure is stacked on the first package, the invention eliminates the need to increase the area of the first package for mounting the antenna structure and hence allows the electronic module to meet the miniaturization requirement.


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