The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 23, 2018

Filed:

Aug. 07, 2017
Applicant:

Ibiden Co., Ltd., Ogaki, JP;

Inventors:

Toru Furuta, Ogaki, JP;

Masashi Awazu, Ogaki, JP;

Assignee:

IBIDEN CO., LTD., Ogaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/16 (2006.01); H05K 1/18 (2006.01); H05K 3/46 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/185 (2013.01); H01L 24/20 (2013.01); H01L 24/32 (2013.01); H05K 1/16 (2013.01); H05K 3/4682 (2013.01);
Abstract

A printed wiring board includes a central resin insulating layer, an electronic component embedded in the central resin insulating layer, a first resin insulating layer formed on a first surface side of the central resin insulating layer, and a second resin insulating layer formed on a second surface side of the central resin insulating layer on the opposite side with respect to the first surface side. The central resin insulating layer does not contain a core material, and one of the first resin insulating layer and the second resin insulating layer includes a core material and the other one of the first resin insulating layer and the second resin insulating layer does not contain a core material.


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