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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10109588 B1

PDFFull Text
Date of Patent:
Oct. 23, 2018

Filed:

May. 11, 2016

Electronic component package and package-on-package structure including the same

Applicant:

Samsung Electro-mechanics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Inventors:

Sung Won Jeong, Suwon-si, KR;

Young Gwan Ko, Suwon-si, KR;

Myung Sam Kang, Suwon-si, KR;

Tae Hong Min, Suwon-si, KR;

Assignee:

SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, Gyeonggi-Do, KR;

Attorney:

McDermott Will & Emery LLP

Primary Examiner:

Michael Lebentritt

Assistant Examiner:

Jordan Klein

Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 23/16 (2006.01); H01L 23/00 (2006.01); H01L 25/10 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01); H01L 23/13 (2006.01); H01L 23/36 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5389 (2013.01); H01L 23/16 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/5383 (2013.01); H01L 23/5384 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 24/96 (2013.01); H01L 24/97 (2013.01); H01L 25/105 (2013.01); H01L 21/568 (2013.01); H01L 23/13 (2013.01); H01L 23/3128 (2013.01); H01L 23/36 (2013.01); H01L 23/49811 (2013.01); H01L 23/49866 (2013.01); H01L 23/49894 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/16227 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/1041 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/145 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1432 (2013.01); H01L 2924/1433 (2013.01); H01L 2924/1436 (2013.01); H01L 2924/1438 (2013.01); H01L 2924/14335 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15321 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/3511 (2013.01);
Abstract

An electronic component package includes a frame containing a metal or ceramic based material and having a through-hole, an electronic component disposed in the through-hole, an insulating part at least covering upper portions of the frame and the electronic component, a bonding part at least partially disposed between the frame and the insulating part, and a redistribution part disposed at one side of the frame and the electronic component.

Find Patent Forward Citations

Quick Actions:

Jeong, Sung. (2018). Electronic component package and package-on-package structure including the same (U.S. Patent No. 10109588). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10109588

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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