The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 23, 2018
Filed:
May. 09, 2017
Applicant:
Mediatek Inc., Hsin-Chu, TW;
Inventors:
Jia-Wei Fang, Hsinchu, TW;
Tzu-Hung Lin, Hsinchu County, TW;
Assignee:
MEDIATEK INC., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 23/48 (2006.01); H01L 23/31 (2006.01); H01L 23/532 (2006.01); H01L 23/482 (2006.01); H01L 25/065 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49811 (2013.01); H01L 23/3142 (2013.01); H01L 23/481 (2013.01); H01L 23/4824 (2013.01); H01L 23/49838 (2013.01); H01L 23/53228 (2013.01); H01L 24/06 (2013.01); H01L 24/09 (2013.01); H01L 23/5226 (2013.01); H01L 25/065 (2013.01); H01L 25/0655 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/08235 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/92125 (2013.01); H01L 2924/157 (2013.01); H01L 2924/1579 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15787 (2013.01);
Abstract
A semiconductor package includes a substrate and a flip-chip on the substrate The flip-chip includes first bump pads and second bump pads on an active surface of the flip-chip. Vias are disposed on the second bump pads. The first bump pads have a pad size that is smaller than that of the second bump pads. An underfill layer is disposed between the flip-chip and the substrate to surround the vias. The underfill layer is in direct contact with a surface of each of the first bump pads.