The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10109551 B1

PDF
Full Text
Expired
Date of Patent:
Oct. 23, 2018

Filed:

Sep. 15, 2015
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Cho-Ying Lu, Hillsboro, OR (US);

Matthias Eberlein, Holzkirchen, DE;

Hyung-Jin Lee, Portland, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 27/16 (2006.01);
U.S. Cl.
CPC ...
H01L 23/34 (2013.01); H01L 27/16 (2013.01);
Abstract

Embodiments of the present disclosure provide techniques and configurations for integrally determining a parameter (e.g., temperature) of a die of an integrated circuit. In one instance, the apparatus may comprise a die including a first (e.g., remote) area and a second (e.g., local) area disposed at a distance from the first area, and circuitry to determine a parameter associated with the remote area of the die. The circuitry may include: a first sensing device disposed in the remote area, to provide first readings associated with the parameter; a second sensing device disposed in the local area, to provide second readings associated with the parameter; and a control module coupled with the sensing devices and disposed in the local area, to facilitate a determination of the parameter based on the first and second readings provided by the first and second sensing devices. Other embodiments may be described and/or claimed.


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