The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 23, 2018

Filed:

May. 26, 2017
Applicant:

Globalfoundries Inc., Grand Cayman, KY;

Inventors:

Qiang Fang, Ballston Lake, NY (US);

Shafaat Ahmed, Ballston Lake, NY (US);

Changhong Wu, Rexford, NY (US);

Zhiguo Sun, Halfmoon, NY (US);

Jiehui Shu, Clifton Park, NY (US);

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 21/768 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76843 (2013.01); H01L 21/76802 (2013.01); H01L 21/76861 (2013.01); H01L 23/53238 (2013.01);
Abstract

A method of forming hybrid Co and Cu CA/CB contacts and the resulting device are provided. Embodiments include forming a forming a plurality of trenches through an ILD down to a substrate; forming a first metal liner on side and bottom surfaces of each trench and over the ILD; annealing the first metal liner; forming a second metal liner over the first metal liner; forming a first plating layer over a portion of the second metal liner in each trench; forming a second plating layer over the second metal liner and first plating layer in a remaining portion of each trench, the first and second plating layers being different materials; and planarizing the second plating layer and the second and first metal liners down to the ILD.


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