The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 23, 2018
Filed:
Mar. 23, 2015
Applicant:
Lintec Corporation, Tokyo, JP;
Inventors:
Assignee:
Lintec Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09D 163/00 (2006.01); H01L 23/544 (2006.01); H01L 21/66 (2006.01); H01L 23/31 (2006.01); H01L 21/683 (2006.01); H01L 21/78 (2006.01); C09J 7/02 (2006.01); H01L 23/29 (2006.01); C08K 5/00 (2006.01); C08K 3/00 (2018.01); C08K 3/013 (2018.01);
U.S. Cl.
CPC ...
C09D 163/00 (2013.01); C09J 7/0207 (2013.01); H01L 21/6836 (2013.01); H01L 21/78 (2013.01); H01L 22/12 (2013.01); H01L 23/295 (2013.01); H01L 23/3171 (2013.01); H01L 23/544 (2013.01); C08K 3/0033 (2013.01); C08K 3/013 (2018.01); C08K 5/0041 (2013.01); C08K 2201/003 (2013.01); C09J 2463/003 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68327 (2013.01); H01L 2223/54406 (2013.01); H01L 2223/54433 (2013.01);
Abstract
A protection membrane-forming film () containing a filler, wherein the average particle size of the filler is not more than 0.4 μm, a protection membrane-forming sheet (), a production method and an inspection method for a workpiece or a processed product which use the film and the sheet, and a workpiece and a processed product determined as adequate products by the inspection method. The protection membrane-forming film and the protection membrane-forming sheet of the invention enable the formation of a protection membrane having excellent print legibility when subjected to print processing by laser irradiation.