The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 23, 2018
Filed:
Aug. 05, 2016
Mitsubishi Chemical Corporation, Chiyoda-ku, JP;
Katsura Ikemiya, Yokohama, JP;
Masanori Yamazaki, Yokohama, JP;
Takuya Suzuki, Yokohama, JP;
Kazuki Takeda, Inashiki-gun, JP;
Toshiyuki Sawamura, Yokohama, JP;
Sawa Hiramatsu, Yokohama, JP;
Tatsushi Isojima, Yokohama, JP;
MITSUBISHI CHEMICAL CORPORATION, Chiyoda-ku, JP;
Abstract
The present invention addresses the problem of providing agglomerated boron nitride particles which are suitable to be used as a thermally conductive filler for a heat dissipation sheet of a power semiconductor device, and which exhibit excellent isotropy of thermal conductivity, excellent degradation resistance, and excellent kneadability with respect to resin. The agglomerated boron nitride particles are obtained by agglomerating boron nitride primary particles. The agglomerated BN articles are characterized in that: a peak area intensity ratio ((100)/(004)) of a (100) plane to a (004) plane of the BN primary particles is 0.25 or more, and the average crystallite size of the BN primary particles obtained from a (002) plane peak of the BN primary particles is 375 Å or more.