The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 16, 2018

Filed:

Dec. 09, 2016
Applicant:

Invensas Corporation, San Jose, CA (US);

Inventors:

Tomoo Iijima, Tokyo, JP;

Yoshitaka Fukuoka, Tokyo, JP;

Assignee:

Invensas Corporation, San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 3/40 (2006.01); H05K 1/16 (2006.01); H05K 1/03 (2006.01); H05K 3/46 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4007 (2013.01); H01L 23/498 (2013.01); H01L 24/19 (2013.01); H05K 1/0393 (2013.01); H05K 1/162 (2013.01); H05K 3/4614 (2013.01); H05K 3/4635 (2013.01); H05K 3/4652 (2013.01); H01L 2924/14 (2013.01); H05K 2201/0367 (2013.01);
Abstract

An electronic assembly is disclosed that includes a flexible insulating film, a semiconductor component that has a thickness of less than 50 micrometers, a conductive interconnect extending through the flexible insulating film, a second patterned metal wiring film adjacent, and a third patterned metal wiring film. The second patterned metal wiring film is electrically coupled with the third patterned metal wiring film through the conductive interconnect. The semiconductor component is coupled to the first patterned metal wiring film and at least one of the second patterned metal wiring film or the third patterned metal wiring film.


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