logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10104781 B1

PDFFull Text
Date of Patent:
Oct. 16, 2018

Filed:

Dec. 22, 2014

Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board

Applicant:

Hitachi Chemical Company, Ltd., Tokyo, JP;

Inventors:

Shota Okade, Tokyo, JP;

Masahiro Miyasaka, Tokyo, JP;

Yukiko Muramatsu, Tokyo, JP;

Assignee:

HITACHI CHEMICAL COMPANY, LTD., Tokyo, JP;

Attorney:

Fitch Even Tabin & Flannery, LLP

Primary Examiner:

Martin J Angebranndt

Int. Cl.
CPC ...
G03F 7/027 (2006.01); G03F 7/028 (2006.01); G03F 7/033 (2006.01); G03F 7/20 (2006.01); G03F 7/38 (2006.01); H05K 3/02 (2006.01); H05K 3/00 (2006.01); C23C 18/16 (2006.01); C25D 3/12 (2006.01); C25D 3/38 (2006.01); C25D 3/48 (2006.01); C25D 7/12 (2006.01); G03F 7/32 (2006.01);
U.S. Cl.
CPC ...
H05K 3/0023 (2013.01); C23C 18/1633 (2013.01); C25D 3/12 (2013.01); C25D 3/38 (2013.01); C25D 3/48 (2013.01); C25D 7/12 (2013.01); G03F 7/027 (2013.01); G03F 7/033 (2013.01); G03F 7/2053 (2013.01); G03F 7/322 (2013.01); G03F 7/38 (2013.01);
Abstract

A photosensitive resin composition includes a binder polymer, a photopolymerizable compound, and a photopolymerization initiator. The binder polymer has a structural unit derived from a (meth)acrylic acid, a structural unit derived from styrene or α-methylstyrene, and a structural unit derived from a hydroxyalkyl (meth)acrylate ester having a hydroxyalkyl group having from 1 to 12 carbon atoms. The photopolymerizable compound include a bisphenolic di(meth)acrylate having from 1 to 20 structural units of an ethyleneoxy group and having from 0 to 7 structural units of a propyleneoxy group.

Find Patent Forward Citations

Quick Actions:

Okade, Shota. (2018). Photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for producing printed wiring board (U.S. Patent No. 10104781). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10104781

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…