The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 16, 2018

Filed:

Jun. 13, 2014
Applicants:

Ziqiang Tong, Munich, DE;

Ralf Reuter, Munich, DE;

Inventors:

Ziqiang Tong, Munich, DE;

Ralf Reuter, Munich, DE;

Assignee:

NXP USA, Inc., Austin, TX (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01Q 19/10 (2006.01); H01L 31/18 (2006.01); H01L 31/0203 (2014.01); G01S 7/03 (2006.01); G01S 13/08 (2006.01); H01Q 9/04 (2006.01); H01Q 23/00 (2006.01); H01L 23/66 (2006.01); H01L 23/00 (2006.01); G01S 13/93 (2006.01); G01S 7/02 (2006.01); H01P 5/107 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01Q 19/10 (2013.01); G01S 7/03 (2013.01); G01S 13/08 (2013.01); H01L 23/66 (2013.01); H01L 24/20 (2013.01); H01L 24/96 (2013.01); H01L 31/0203 (2013.01); H01L 31/18 (2013.01); H01Q 9/0407 (2013.01); H01Q 23/00 (2013.01); G01S 13/931 (2013.01); G01S 2007/028 (2013.01); H01L 21/568 (2013.01); H01L 2223/6677 (2013.01); H01L 2223/6688 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10271 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15321 (2013.01); H01P 5/107 (2013.01);
Abstract

An integrated circuit package comprises an electrically conductive material, a first electrically isolating layer having a first side in contact with the electrically conductive material and a second side opposite to the first side, a second electrically isolating layer stacked at the second side with at least the first electrically isolating layer and arranged at a package side, and an integrated antenna structure arranged between the first electrically isolating layer and the second electrically isolating layer. The electrically conductive material is encapsulated by a dielectric material, arranged to partly overlap the integrated antenna structure, separated from the integrated antenna structure by at least the first electrically isolating layer and arranged to reflect a radio frequency signal received by the electrically conductive material through at least the first electrically isolating layer to the package side.


Find Patent Forward Citations

Tong, Ziqiang. (2018). Integrated circuit package with radio frequency coupling structure (U.S. Patent No. 10103447). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10103447

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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