The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 16, 2018

Filed:

Apr. 28, 2017
Applicant:

Semiconductor Manufacturing International (Shanghai) Corporation, Shanghai, CN;

Inventor:

Deyuan Xiao, Shanghai, CN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/78 (2006.01); H01L 29/786 (2006.01); H01L 29/423 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
H01L 29/78609 (2013.01); H01L 29/42392 (2013.01); H01L 29/66522 (2013.01); H01L 29/66666 (2013.01); H01L 29/66742 (2013.01); H01L 29/78642 (2013.01); H01L 29/78645 (2013.01); H01L 29/78681 (2013.01); H01L 29/78696 (2013.01);
Abstract

A semiconductor device includes a silicon substrate, a silicon germanium (SiGe) layer including a lower portion extending over the silicon substrate and a fin structure protruding above the lower portion, a first dielectric layer disposed over a side surface of the fin structure and a top surface of the lower portion of the silicon germanium (SiGe) layer, an indium gallium arsenide (InGaAs) layer disposed over a surface of the first dielectric layer, a high k oxide layer disposed over a surface of the InGaAs layer, and a metal layer disposed over a surface of the high k oxide layer. The InGaAs layer includes a source region, a channel region, and a drain region. The metal layer is configured to be a first gate electrode, and the fin structure in the SiGe layer is configured to be a second gate electrode.


Find Patent Forward Citations

Loading…