The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 16, 2018
Filed:
May. 10, 2017
Applicants:
Tae-wan Lim, Suwon-si, KR;
Hojong Kang, Cheongju-si, KR;
Joowon Park, Seoul, KR;
Inventors:
Assignee:
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 21/4763 (2006.01); H01L 29/423 (2006.01); H01L 23/485 (2006.01); H01L 29/792 (2006.01); H01L 23/31 (2006.01); H01L 27/11582 (2017.01); H01L 21/28 (2006.01); H01L 21/768 (2006.01); H01L 23/522 (2006.01); H01L 29/66 (2006.01); H01L 27/1157 (2017.01); H01L 27/11575 (2017.01);
U.S. Cl.
CPC ...
H01L 29/4234 (2013.01); H01L 21/28282 (2013.01); H01L 21/76805 (2013.01); H01L 21/76816 (2013.01); H01L 23/3171 (2013.01); H01L 23/485 (2013.01); H01L 23/5226 (2013.01); H01L 27/1157 (2013.01); H01L 27/11575 (2013.01); H01L 27/11582 (2013.01); H01L 29/66833 (2013.01); H01L 29/7926 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A method for manufacturing a semiconductor device includes forming a conductive pattern on a substrate, forming a filling insulation layer covering the conductive pattern, forming a contact hole in the filling insulation layer and adjacent to the conductive pattern, forming an opening in the conductive pattern by removing a portion of the conductive pattern adjacent to the contact hole such that the opening is connected to the contact hole, and forming a contact plug filling the contact hole and the opening. A width of the opening is greater than a width of the contact hole.