The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 16, 2018

Filed:

Mar. 29, 2017
Applicant:

Gpower Semiconductor, Inc., Suzhou, CN;

Inventors:

Yi Pei, Suzhou, CN;

Yuan Li, Suzhou, CN;

Chuanjia Wu, Suzhou, CN;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 29/778 (2006.01); H01L 29/205 (2006.01); H01L 29/20 (2006.01); H01L 29/66 (2006.01); H01L 21/3065 (2006.01); H01L 21/308 (2006.01);
U.S. Cl.
CPC ...
H01L 29/0607 (2013.01); H01L 21/3065 (2013.01); H01L 21/3086 (2013.01); H01L 29/0684 (2013.01); H01L 29/2003 (2013.01); H01L 29/205 (2013.01); H01L 29/66462 (2013.01); H01L 29/7786 (2013.01);
Abstract

The present disclosure discloses a power semiconductor device and a method for manufacturing the same. The power semiconductor device comprises: a substrate, a channel layer, a barrier layer, a source electrode, a drain electrode, a gate electrode, and a junction termination structure located on the barrier layer. The power semiconductor device extends in a first direction from an edge of a side of the gate electrode close to the drain electrode to the drain electrode, the junction termination structure at least comprises a first region close to the gate electrode and a second region away from the gate electrode and the thickness of the first region is greater than that of the second region in a second direction perpendicular to the barrier layer. The junction termination structure can effectively improve the distribution of an electric field of the barrier layer and hence increase the breakdown voltage of the device.


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