The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 16, 2018
Filed:
May. 07, 2017
Mediatek Inc., Hsin-Chu, TW;
Che-Ya Chou, Kaohsiung, TW;
Kun-Ting Hung, Hsinchu, TW;
Chia-Hao Yang, Hsinchu, TW;
Nan-Cheng Chen, Hsinchu, TW;
MEDIATEK INC., Hsin-Chu, TW;
Abstract
A semiconductor package is provided. The semiconductor package includes a carrier substrate having opposite first surface and second surface, and a chip stack disposed on the first surface of the carrier substrate. The chip stack includes a first semiconductor die, a second semiconductor die, and an interposer between the first semiconductor die and the second semiconductor die. The interposer transmits signals between the first semiconductor die and the second semiconductor die.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile