The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 16, 2018
Filed:
Nov. 16, 2015
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-Si, Gyeonggi-Do, KR;
Inventors:
Moon Soo Park, Suwon-Si, KR;
Jong Sik Yoon, Suwon-Si, KR;
Kyung Han Ahn, Suwon-Si, KR;
Dong Hwan Lee, Suwon-Si, KR;
Hye Yeon Cha, Suwon-Si, KR;
Jong Ho Lee, Suwon-Si, KR;
Assignee:
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 41/04 (2006.01); H01F 17/00 (2006.01); H01F 17/04 (2006.01);
U.S. Cl.
CPC ...
H01F 41/046 (2013.01); H01F 17/0013 (2013.01); H01F 17/04 (2013.01); H01F 2017/048 (2013.01); Y10T 29/49078 (2015.01);
Abstract
A method of manufacturing an electronic component having high inductance (L) and an excellent quality (Q) factor and direct current (DC)-bias characteristics includes forming a magnetic body in which internal coil parts are embedded, and forming a cover part including a magnetic metal plate on at least one of upper and lower portions of the magnetic body.