The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 16, 2018
Filed:
Sep. 25, 2016
Applicant:
Ralph Remsburg, Midland, TX (US);
Inventor:
Ralph Remsburg, Midland, TX (US);
Assignee:
COOLER MASTER CO., LTD., New Taipei, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F28F 1/42 (2006.01); F28F 3/02 (2006.01); H01L 23/367 (2006.01); H01L 23/467 (2006.01); H01L 23/473 (2006.01); F28F 1/12 (2006.01);
U.S. Cl.
CPC ...
F28F 1/42 (2013.01); F28F 1/124 (2013.01); F28F 3/022 (2013.01); H01L 23/3677 (2013.01); H01L 23/467 (2013.01); H01L 23/473 (2013.01); F28F 2215/04 (2013.01); F28F 2250/02 (2013.01);
Abstract
A bonded dissimilar material heat transfer assembly is provided. The assembly comprises a frame component, a thin stamped component and at least one dissimilar metal component having means for heat transfer and having a higher thermal conductivity than the frame component and stamped component. The heat transfer assembly includes a novel geometry such that distortion caused by mismatch of thermal expansion rates does not affect the normally planar shape of the assembly. Such a construction leads to higher thermal performance, lighter weight, less cost, and higher reliability than similar prior art heat exchanger assemblies.