The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 16, 2018
Filed:
Dec. 29, 2015
Applicant:
Hong Kong Applied Science and Technology Research Institute Company Limited, Hong Kong, HK;
Inventors:
Yaofeng Sun, Hong Kong, HK;
Minjie Xu, Hong Kong, HK;
Shun Yee Lao, Honk Kong, HK;
Shu Kin Yau, Hong Kong, HK;
Assignee:
Primary Examiner:
Int. Cl.
CPC ...
C25D 3/38 (2006.01);
U.S. Cl.
CPC ...
C25D 3/38 (2013.01);
Abstract
The presently claimed invention provides a plating additive for electrodeposition, and the corresponding fabrication method thereof. The plating additive of the present invention enables to electroplate holes on a substrate with good height uniformity within a feature and among features at different diameters.