The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 16, 2018

Filed:

Jun. 21, 2017
Applicants:

Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;

Sungkyunkwan University Foundation for Corporate Collaboration, Suwon-Si, Gyeonggi-Do, KR;

Inventors:

Hyeon-jin Shin, Suwon-si, KR;

Sang-Woo Kim, Seoul, KR;

Jin yeong Lee, Seoul, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/34 (2006.01); B32B 15/04 (2006.01); C23C 28/00 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
B32B 15/04 (2013.01); C23C 16/342 (2013.01); C23C 28/34 (2013.01); H01L 21/02458 (2013.01); B32B 2457/00 (2013.01); Y10T 428/31678 (2015.04);
Abstract

A method of forming a substrate assembly includes preparing a substrate in a chamber, combining a solid-state nitrogen source and a boron source on the substrate, forming a metal layer on a surface of the substrate including the combined solid-state nitrogen and boron sources, and forming a first hexagonal boron nitride sheet directly bonded to the surface of the substrate by performing a heat treatment on the substrate including the metal layer and the combined solid-state nitrogen and boron sources.


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