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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10098228 B1

PDFFull Text
Date of Patent:
Oct. 09, 2018

Filed:

Aug. 24, 2015

Electronic component device and method for manufacturing the same

Applicant:

Shinko Electric Industries Co., Ltd., Nagano-shi, Nagano, JP;

Inventor:

Masahiro Kyozuka, Nagano, JP;

Assignee:

SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano-Shi, JP;

Attorney:

Rankin, Hill & Clark LLP

Primary Examiner:

Nathan Milakovich

Int. Cl.
CPC ...
H05K 1/14 (2006.01); H01L 23/538 (2006.01); H01L 23/31 (2006.01); H01L 21/48 (2006.01); H01L 25/10 (2006.01); H01L 25/00 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H05K 1/144 (2013.01); H01L 21/486 (2013.01); H01L 23/3121 (2013.01); H01L 23/3135 (2013.01); H01L 23/5385 (2013.01); H01L 23/5389 (2013.01); H01L 25/105 (2013.01); H01L 25/50 (2013.01); H01L 23/49811 (2013.01); H01L 23/5384 (2013.01); H01L 25/0655 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1041 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/1533 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/18161 (2013.01); H05K 2201/042 (2013.01); H05K 2201/10242 (2013.01);
Abstract

An electronic component device includes a cored wiring substrate, an electronic component, a reinforcing layer, a connection terminal, and sealing resin. The cored wiring substrate includes a core layer. The electronic component is mounted on the cored wiring substrate. The coreless wiring substrate is disposed on the cored wiring substrate and the electronic component. The reinforcing layer is provided in the coreless wiring substrate and in a region corresponding to the electronic component. The connection terminal connects the cored wiring substrate and the coreless wiring substrate. The sealing resin is filled between the cored wiring substrate and the coreless wiring substrate.

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