The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 09, 2018

Filed:

Feb. 25, 2016
Applicant:

Fujifilm Corporation, Tokyo, JP;

Inventors:

Pawel Malinowski, Leuven, BE;

Atsushi Nakamura, Zwijndrecht, BE;

Yu Iwai, Shizuoka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/311 (2006.01); H01L 51/00 (2006.01); H01L 51/42 (2006.01); H01L 51/05 (2006.01); H01L 51/56 (2006.01);
U.S. Cl.
CPC ...
H01L 51/0018 (2013.01); H01L 51/0097 (2013.01); H01L 51/4253 (2013.01); H01L 51/0036 (2013.01); H01L 51/0047 (2013.01); H01L 51/0508 (2013.01); H01L 51/42 (2013.01); H01L 51/56 (2013.01);
Abstract

A method is provided for photolithographic patterning of an organic layer, comprising: providing a shielding layer on the organic layer; providing a photoresist layer on the shielding layer; illuminating the photoresist layer through a shadow mask; developing the photoresist layer, thereby forming a patterned photoresist layer; performing a first dry etching step using the patterned photoresist layer as a mask, thereby removing at least an upper portion of the photoresist layer and completely removing the shielding layer at locations not covered by the photoresist layer; performing a second dry etching step using the patterned shielding layer as a mask, thereby removing the organic layer at locations not covered by the shielding layer; and removing the shielding layer, wherein removing the shielding layer comprises exposing it to water. A method of the present disclosure may advantageously be used in a process for fabricating organic semiconductor based devices and circuits.


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