The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 09, 2018

Filed:

Nov. 18, 2011
Applicants:

Huilong Zhu, Poughkeepsie, NY (US);

Qingqing Liang, Lagrangeville, NY (US);

Haizhou Yin, Poughkeepsie, NY (US);

Zhijiong Luo, Poughkeepsie, NY (US);

Inventors:

Huilong Zhu, Poughkeepsie, NY (US);

Qingqing Liang, Lagrangeville, NY (US);

Haizhou Yin, Poughkeepsie, NY (US);

Zhijiong Luo, Poughkeepsie, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/336 (2006.01); H01L 29/786 (2006.01); H01L 21/265 (2006.01); H01L 29/66 (2006.01); H01L 21/74 (2006.01);
U.S. Cl.
CPC ...
H01L 29/78648 (2013.01); H01L 29/66772 (2013.01); H01L 21/2652 (2013.01); H01L 21/2658 (2013.01); H01L 21/74 (2013.01); H01L 29/66545 (2013.01);
Abstract

The present disclosure discloses a MOSFET and a method for manufacturing the same, wherein the MOSFET comprises: an SOI wafer comprising a semiconductor substrate, a buried insulating layer on the semiconductor substrate, and a semiconductor layer on the buried insulating layer; a gate stack on the semiconductor layer; a source region and a drain region in the semiconductor layer on both sides of the gate stack; and a channel region in the semiconductor layer and located between the source region and the drain region, wherein the MOSFET further comprises a back gate which is located in the semiconductor substrate and has a first doped region as a lower portion of the back gate and a second doped region as an upper portion of the back gate, and the second doped region of the back gate is self-aligned with the gate stack. The MOSFET can adjust a threshold voltage by changing doping type and doping concentration of the back gate.


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