The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 09, 2018
Filed:
Oct. 16, 2017
Lam Research Corporation, Fremont, CA (US);
Gabriel Hay Graham, Portland, OR (US);
Lee Peng Chua, Beaverton, OR (US);
Boon Kang Ong, Beaverton, OR (US);
Lam Research Corporation, Fremont, CA (US);
Abstract
Various embodiments herein relate to methods and apparatus for electroplating material onto substrates. Often the substrate is a semiconductor substrate. Various techniques described herein utilize a number of different electroplating stages, where the convection conditions vary between the different electroplating stages. In many cases, at least one ultra-low convection stage is used. The ultra-low convection stage may be paired with an initial stage and a final stage that have higher convection conditions. By controlling the convection conditions as described herein, very uniform plating results can be achieved, even when differently sized and/or shaped features are provided on a single substrate.