The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 02, 2018

Filed:

Feb. 07, 2018
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Qinghua Li, San Ramon, CA (US);

Honggang Li, Beijing, CN;

Huaning Niu, Milpitas, CA (US);

Yi Hsuan, Sunnyvale, CA (US);

Yuan Zhu, Beijing, CN;

Xiaogang Chen, Portland, OR (US);

Jong-Kae Fwu, Sunnyvale, CA (US);

Alexei Vladimirovich Davydov, Nizhny Novgorod, RU;

Hujun Yin, Saratoga, CA (US);

Xintian E. Lin, Palo Alto, CA (US);

Wendy C. Wong, San Jose, CA (US);

Yujian Zhang, Beijing, CN;

Apostolos Papathanassiou, Campbell, CA (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04W 74/08 (2009.01); H04W 28/08 (2009.01); H04W 28/02 (2009.01); H04L 5/00 (2006.01); H04L 5/14 (2006.01); H04W 72/04 (2009.01); H04W 4/06 (2009.01); H04W 72/08 (2009.01); H04W 24/02 (2009.01); H04W 24/10 (2009.01); H04W 36/08 (2009.01); H04W 4/70 (2018.01); H04L 12/18 (2006.01); H04W 36/00 (2009.01); H04W 76/19 (2018.01);
U.S. Cl.
CPC ...
H04W 74/0808 (2013.01); H04L 5/0001 (2013.01); H04L 5/0023 (2013.01); H04L 5/0037 (2013.01); H04L 5/0044 (2013.01); H04L 5/0048 (2013.01); H04L 5/0053 (2013.01); H04L 5/0064 (2013.01); H04L 5/0094 (2013.01); H04L 5/14 (2013.01); H04W 4/06 (2013.01); H04W 4/70 (2018.02); H04W 24/02 (2013.01); H04W 24/10 (2013.01); H04W 28/02 (2013.01); H04W 28/0268 (2013.01); H04W 28/08 (2013.01); H04W 36/08 (2013.01); H04W 72/04 (2013.01); H04W 72/042 (2013.01); H04W 72/0406 (2013.01); H04W 72/085 (2013.01); H04W 74/0833 (2013.01); H04L 12/189 (2013.01); H04W 36/0016 (2013.01); H04W 76/19 (2018.02); Y02D 70/00 (2018.01); Y02D 70/1224 (2018.01); Y02D 70/1242 (2018.01); Y02D 70/1262 (2018.01); Y02D 70/1264 (2018.01); Y02D 70/142 (2018.01); Y02D 70/144 (2018.01); Y02D 70/146 (2018.01); Y02D 70/164 (2018.01); Y02D 70/21 (2018.01); Y02D 70/24 (2018.01);
Abstract

A signal structure for use in D2D communications is described. In one embodiment, a preamble for automatic gain control at the receiver end is included in the transmitted signal. Techniques for scheduling of D2D transmissions using carrier sensing multiple access (CSMA) and a power control schemes for interference management are also described.


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