The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 02, 2018

Filed:

Feb. 24, 2017
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

John B. Campi, Jr., Westford, VT (US);

Robert J. Gauthier, Jr., Hinesburg, VT (US);

Rahul Mishra, Essex Junction, VT (US);

Souvick Mitra, Essex Junction, VT (US);

Mujahid Muhammad, Essex Junction, VT (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 29/423 (2006.01); H01L 29/08 (2006.01); H01L 21/265 (2006.01);
U.S. Cl.
CPC ...
H01L 29/66712 (2013.01); H01L 21/26513 (2013.01); H01L 29/0865 (2013.01); H01L 29/0869 (2013.01); H01L 29/0882 (2013.01); H01L 29/0886 (2013.01); H01L 29/4238 (2013.01); H01L 29/42376 (2013.01); H01L 29/7809 (2013.01); H01L 29/7811 (2013.01);
Abstract

A gate-all around fin double diffused metal oxide semiconductor (DMOS) devices and methods of manufacture are disclosed. The method includes forming a plurality of fin structures from a substrate. The method further includes forming a well of a first conductivity type and a second conductivity type within the substrate and corresponding fin structures of the plurality of fin structures. The method further includes forming a source contact on an exposed portion of a first fin structure. The method further comprises forming drain contacts on exposed portions of adjacent fin structures to the first fin structure. The method further includes forming a gate structure in a dielectric fill material about the first fin structure and extending over the well of the first conductivity type.


Find Patent Forward Citations

Loading…