The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 02, 2018

Filed:

May. 19, 2017
Applicant:

Invensas Corporation, San Jose, CA (US);

Inventors:

Richard Dewitt Crisp, Hornitos, CA (US);

Wael Zohni, Campbell, CA (US);

Belgacem Haba, Saratoga, CA (US);

Frank Lambrecht, Mountain View, CA (US);

Assignee:

Invensas Corporation, San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01); H01L 25/10 (2006.01); H05K 1/18 (2006.01); H01L 23/00 (2006.01); G06F 1/18 (2006.01); H01L 23/367 (2006.01); H01L 23/36 (2006.01); H01L 23/48 (2006.01); H01L 23/525 (2006.01); H01L 21/56 (2006.01); H01L 23/50 (2006.01); H05K 1/02 (2006.01); H01L 23/538 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); G06F 1/18 (2013.01); H01L 23/3128 (2013.01); H01L 23/3672 (2013.01); H01L 23/49816 (2013.01); H01L 23/49838 (2013.01); H01L 24/24 (2013.01); H01L 25/0655 (2013.01); H01L 25/105 (2013.01); H05K 1/181 (2013.01); H01L 21/563 (2013.01); H01L 23/36 (2013.01); H01L 23/481 (2013.01); H01L 23/50 (2013.01); H01L 23/525 (2013.01); H01L 23/5385 (2013.01); H01L 24/73 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/24145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/48471 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73265 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06541 (2013.01); H01L 2225/06551 (2013.01); H01L 2225/06562 (2013.01); H01L 2225/06589 (2013.01); H01L 2924/00 (2013.01); H01L 2924/00012 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/18161 (2013.01); H01L 2924/3011 (2013.01); H05K 1/0243 (2013.01); H05K 2201/10159 (2013.01); H05K 2201/10545 (2013.01); H05K 2201/10734 (2013.01); Y02P 70/611 (2015.11);
Abstract

A microelectronic assembly () or system () includes at least one microelectronic package () having a microelectronic element () mounted face up above a first surface () of a substrate (), one or more columns () of contacts () extending in a first direction () along the microelectronic element front face. Columns (A,B,A,B) of terminals () exposed at a second surface () of the substrate extend in the first direction. First terminals () exposed at surface () in a central region () thereof having width () not more than three and one-half times a minimum pitch () of the columns of terminals can be configured to carry address information usable to determine an addressable memory location. An axial plane of the microelectronic element can intersect the central region.


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