The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 02, 2018

Filed:

Oct. 15, 2014
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsin-Chu, TW;

Inventors:

Chien-Chih Chiu, Xinying, TW;

Ming-Chung Liang, Hsin-Chu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/311 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 21/31116 (2013.01); H01L 21/31144 (2013.01); H01L 21/76804 (2013.01); H01L 21/76813 (2013.01); H01L 21/76877 (2013.01);
Abstract

Semiconductor devices and methods of forming the same are disclosed. A dielectric layer is formed over an underlying layer. A first mask layer and a second mask layer are formed on the dielectric layer such that the first mask layer is interposed between the second mask layer and the dielectric layer. An opening is formed in the first mask layer, the second mask layer and the dielectric layer. Subsequently, the second mask layer is removed. The opening is extended and corners of the first mask layer are rounded. A conductive feature is formed in the extended opening.


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