The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 02, 2018
Filed:
May. 14, 2013
Applicant:
Lintec Corporation, Tokyo, JP;
Inventors:
Assignee:
LINTEC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 37/12 (2006.01); B32B 27/08 (2006.01); B32B 27/32 (2006.01); B32B 37/18 (2006.01); B32B 38/10 (2006.01); C09J 133/08 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); B32B 27/30 (2006.01); C09J 7/38 (2018.01);
U.S. Cl.
CPC ...
B32B 37/12 (2013.01); B32B 27/08 (2013.01); B32B 27/302 (2013.01); B32B 27/32 (2013.01); B32B 37/18 (2013.01); B32B 38/10 (2013.01); C09J 7/38 (2018.01); C09J 133/08 (2013.01); H01L 21/6835 (2013.01); H01L 24/83 (2013.01); B32B 2255/26 (2013.01); B32B 2307/54 (2013.01); B32B 2307/546 (2013.01); B32B 2405/00 (2013.01); B32B 2457/14 (2013.01); C09J 2203/326 (2013.01); H01L 2224/3224 (2013.01); H01L 2224/3226 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/8385 (2013.01); H01L 2924/12042 (2013.01); Y10T 428/287 (2015.01); Y10T 428/2848 (2015.01);
Abstract
A sheet having an adhesive resin layer attached thereto includes a base and an adhesive resin layer laminated on the base. The rate of shrinkage of the base in each of an MD direction and a CD direction after the heating of the sheet at 70° C. for 1 minute is −0.5 to 0.5% and the bending resistance of the base is 80 mm or more.