The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 02, 2018

Filed:

Oct. 30, 2014
Applicant:

Jsr Corporation, Tokyo, JP;

Inventors:

Torahiko Yamaguchi, Tokyo, JP;

Hiroyuki Ishii, Tokyo, JP;

Katsumi Inomata, Tokyo, JP;

Assignee:

JSR CORPORATION, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 7/06 (2006.01); B32B 7/12 (2006.01); B32B 27/08 (2006.01); B32B 27/18 (2006.01); B32B 27/30 (2006.01); B32B 27/36 (2006.01); B32B 37/26 (2006.01); B32B 38/10 (2006.01); B32B 43/00 (2006.01); C09J 165/00 (2006.01); H01L 21/683 (2006.01); B32B 37/12 (2006.01);
U.S. Cl.
CPC ...
B32B 7/06 (2013.01); B32B 7/12 (2013.01); B32B 27/08 (2013.01); B32B 27/18 (2013.01); B32B 27/308 (2013.01); B32B 27/36 (2013.01); B32B 37/1284 (2013.01); B32B 38/10 (2013.01); B32B 43/006 (2013.01); C09J 165/00 (2013.01); H01L 21/6835 (2013.01); H01L 21/6836 (2013.01); B32B 2037/268 (2013.01); B32B 2307/748 (2013.01); B32B 2457/14 (2013.01); C08G 2261/3324 (2013.01); C08G 2261/418 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68381 (2013.01); H01L 2221/68386 (2013.01);
Abstract

There is shown a stack including a substrate material temporarily fixed on a support via a temporary fixing material, wherein the temporary fixing material includes a temporary fixing material layer (I) in contact with the support-facing surface of the substrate material, and a temporary fixing material layer (II) formed on the support-facing surface of the layer (I), wherein the temporary fixing material layer (I) is formed of a temporary fixing composition containing a polymer (A) and a release agent (B) which contains a functional group capable of reacting with the polymer (A) to form a chemical bond.


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