The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 25, 2018

Filed:

Aug. 25, 2014
Applicant:

GE Embedded Electronics Oy, Helsinki, FI;

Inventors:

Risto Tuominen, Helsinki, FI;

Petteri Palm, Helsinki, FI;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01K 1/18 (2006.01); H01L 23/538 (2006.01); H05K 1/18 (2006.01); H01L 23/552 (2006.01); H01L 23/00 (2006.01); H01L 25/10 (2006.01); H01L 25/00 (2006.01); H01L 23/544 (2006.01); H05K 1/02 (2006.01); H05K 3/46 (2006.01); H01L 23/29 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
H05K 1/189 (2013.01); H01L 23/5387 (2013.01); H01L 23/5389 (2013.01); H01L 23/552 (2013.01); H01L 24/19 (2013.01); H01L 24/24 (2013.01); H01L 24/82 (2013.01); H01L 25/105 (2013.01); H01L 25/50 (2013.01); H05K 1/188 (2013.01); H01L 23/295 (2013.01); H01L 23/544 (2013.01); H01L 24/96 (2013.01); H01L 2223/54426 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/82106 (2013.01); H01L 2224/82132 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/0103 (2013.01); H01L 2924/014 (2013.01); H01L 2924/01005 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01024 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01055 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/01327 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/3025 (2013.01); H01L 2924/3511 (2013.01); H05K 1/0269 (2013.01); H05K 3/284 (2013.01); H05K 3/4611 (2013.01); H05K 2201/0355 (2013.01); H05K 2201/0367 (2013.01); H05K 2201/042 (2013.01); H05K 2201/056 (2013.01); H05K 2201/09918 (2013.01); H05K 2201/10674 (2013.01); H05K 2203/063 (2013.01); H05K 2203/166 (2013.01);
Abstract

The present invention relates to an electronic module. In particular, to an electronic module which includes one or more components embedded in an installation base. The electronic module can be a module like a circuit board, which includes several components, which are connected to each other electrically, through conducting structures manufactured in the module. The components can be passive components, microcircuits, semiconductor components, or other similar components. Components that are typically connected to a circuit board form one group of components. Another important group of components are components that are typically packaged for connection to a circuit board. The electronic modules to which the invention relates can, of course, also include other types of components.


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