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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10083911 B1

PDFFull Text
Date of Patent:
Sep. 25, 2018

Filed:

Feb. 08, 2017

Semiconductor device package and method of manufacturing the same

Applicant:

Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;

Inventors:

Hao-Chih Hsieh, Kaohsiung, TW;

Tun-Ching Pi, Kaohsiung, TW;

Assignee:

ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;

Attorneys:

Foley & Lardner LLP

Cliff Z. Liu

Primary Examiner:

Allan R Wilson

Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 23/538 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5387 (2013.01); H01L 21/561 (2013.01); H01L 23/3121 (2013.01); H01L 23/3142 (2013.01); H01L 23/5386 (2013.01); H01L 25/0655 (2013.01); H01L 25/50 (2013.01);
Abstract

A semiconductor device package includes a flexible substrate, an electronic component, at least one flexible member, and a package body. The electronic component is disposed on the flexible substrate. The at least one flexible member is disposed on the flexible substrate. The package body encapsulates the electronic component and has a first part and a second part separated from the first part by the at least one flexible member.

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Hsieh, Hao-Chih. (2018). Semiconductor device package and method of manufacturing the same (U.S. Patent No. 10083911). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10083911

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