The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 25, 2018
Filed:
Aug. 17, 2017
Disco Corporation, Tokyo, JP;
Hideyuki Sandoh, Tokyo, JP;
Disco Corporation, Tokyo, JP;
Abstract
A method of processing a wafer having a metal film formed on a reverse side thereof includes removing a metal film on the reverse side of the wafer along an outer circumferential edge of the wafer, thereby exposing a substrate of the wafer along the outer circumferential edge thereof, detecting a projected dicing line on a face side of the wafer with an infrared camera through the substrate exposed along the outer circumferential edge of the wafer and performing alignment of the wafer based on the detected projected dicing line, removing the metal film on the reverse side of the wafer along the detected projected dicing line, and thereafter, forming dividing grooves in the substrate along the projected dicing lines by plasma etching, thereby dividing the wafer into individual device chips.