The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 25, 2018

Filed:

Jan. 18, 2018
Applicant:

Bgt Materials Limited, Manchester, GB;

Inventor:

Chung-Ping Lai, Hsinchu County, TW;

Assignee:

BGT MATERIALS LIMITED, Manchester, GB;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F21K 9/90 (2016.01); F21K 9/232 (2016.01); F21V 29/70 (2015.01); F21V 29/85 (2015.01); F21K 9/237 (2016.01); F21V 19/00 (2006.01); H01L 25/075 (2006.01); H01L 33/62 (2010.01); H01L 33/50 (2010.01); H01L 33/64 (2010.01); H01L 23/00 (2006.01); F21Y 115/10 (2016.01);
U.S. Cl.
CPC ...
F21K 9/90 (2013.01); F21K 9/232 (2016.08); F21K 9/237 (2016.08); F21V 19/0015 (2013.01); F21V 29/70 (2015.01); F21V 29/85 (2015.01); H01L 24/48 (2013.01); H01L 25/0753 (2013.01); H01L 33/502 (2013.01); H01L 33/62 (2013.01); H01L 33/641 (2013.01); F21Y 2115/10 (2016.08); H01L 2224/48137 (2013.01); H01L 2924/12041 (2013.01); H01L 2933/0041 (2013.01); H01L 2933/0066 (2013.01); H01L 2933/0075 (2013.01);
Abstract

A method of making a LED light bulb with thermal radiation filaments contains steps of: A. providing a substrate which includes multiple conductive portions formed on two ends of the substrate respectively so as to electrically connect with an electronic circuit; B. molding LED chips, wires, and phosphors on a front face of the substrate so as to produce a LED filament sheet; C. forming a thermal radiation dissipation film on a back face of the substrate before or after producing the LED filament sheet; D. cutting the substrate into the thermal radiation filaments, wherein each of the thermal radiation filaments has a part of the thermal radiation dissipation film, a part of the LED filament sheet, and parts of the multiple conductive portions respectively; and E. fixing the thermal radiation filaments into the LED light bulb.


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