The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 25, 2018

Filed:

Jul. 31, 2014
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Ulrich Schmid, Vienna, AT;

Tobias Frischmuth, Vienna, AT;

Peter Irsigler, Obernberg/Inn, AT;

Thomas Grille, Villach, AT;

Daniel Maurer, Feld am See, AT;

Ursula Hedenig, Villach, AT;

Markus Kahn, Rangersdorf, AT;

Günter Denifl, Annenheim, AT;

Assignee:

INFINEON TECHNOLOGIES AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B81B 3/00 (2006.01); B06B 1/02 (2006.01); B81C 1/00 (2006.01); H04R 19/02 (2006.01); H04R 19/04 (2006.01); H04R 31/00 (2006.01); H04R 7/24 (2006.01); H04R 7/02 (2006.01); H04R 19/00 (2006.01);
U.S. Cl.
CPC ...
B81B 3/0021 (2013.01); B06B 1/02 (2013.01); B81B 3/007 (2013.01); B81C 1/0015 (2013.01); B81C 1/00142 (2013.01); B81C 1/00158 (2013.01); B81C 1/00373 (2013.01); H04R 7/02 (2013.01); H04R 7/24 (2013.01); H04R 19/005 (2013.01); H04R 19/02 (2013.01); H04R 19/04 (2013.01); H04R 31/00 (2013.01); H04R 31/003 (2013.01); B81B 2201/0257 (2013.01); B81B 2201/0264 (2013.01); B81B 2203/0109 (2013.01); B81B 2203/0118 (2013.01); B81B 2203/0127 (2013.01); B81B 2203/051 (2013.01); B81C 2201/019 (2013.01); B81C 2201/0176 (2013.01); B81C 2201/0181 (2013.01); H04R 2201/003 (2013.01); H04R 2307/023 (2013.01); H04R 2400/01 (2013.01); H04R 2499/11 (2013.01);
Abstract

A micromechanical structure includes a substrate and a functional structure arranged at the substrate. The functional structure has a functional region configured to deflect with respect to the substrate responsive to a force acting on the functional region. The functional structure includes a conductive base layer and a functional structure comprising a stiffening structure having a stiffening structure material arranged at the conductive base layer and only partially covering the conductive base layer at the functional region. The stiffening structure material includes a silicon material and at least a carbon material.


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