logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10079222 B1

PDFFull Text
Date of Patent:
Sep. 18, 2018

Filed:

Nov. 16, 2016

Package-on-package structure and manufacturing method thereof

Applicant:

Powertech Technology Inc., Hsinchu County, TW;

Inventors:

Chien-Wei Chou, Hsinchu County, TW;

Yong-Cheng Chuang, Hsinchu County, TW;

Assignee:

Powertech Technology Inc., Hsinchu County, TW;

Attorney:

JCIPRNET

Primary Examiner:

A Sefer

Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 25/065 (2006.01); H05K 1/18 (2006.01); H05K 1/11 (2006.01); H01L 23/495 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01); H01L 25/00 (2006.01); H01L 21/48 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 21/4821 (2013.01); H01L 23/3128 (2013.01); H01L 23/49541 (2013.01); H01L 23/49568 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 23/49861 (2013.01); H01L 25/50 (2013.01); H05K 1/0203 (2013.01); H05K 1/111 (2013.01); H05K 1/181 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48227 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06572 (2013.01); H01L 2225/06579 (2013.01); H01L 2225/06586 (2013.01); H01L 2225/06589 (2013.01); H01L 2924/1433 (2013.01); H01L 2924/1434 (2013.01);
Abstract

A POP structure includes a circuit board, a bottom package structure, a top package structure, and a metal frame structure. The circuit board has a plurality of signal pads and dummy pads. The dummy pads surround the signal pads. The bottom package structure is disposed over the circuit board. The bottom package structure is electrically connected to the signal pads. The top package structure is disposed over the bottom package structure. The top package structure is electrically connected to the bottom package structure. The metal frame structure includes a body and a plurality of terminal pins. The body is located between the top package structure and the bottom package structure. The terminal pins extend outward from an edge of the top package structure to connect the top package structure and the dummy pads of the circuit board.

Find Patent Forward Citations

Chou, Chien-Wei. (2018). Package-on-package structure and manufacturing method thereof (U.S. Patent No. 10079222). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10079222

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…