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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10079157 B1

PDFFull Text
Date of Patent:
Sep. 18, 2018

Filed:

Dec. 22, 2015

Semiconductor device and manufacturing method thereof

Applicant:

Amkor Technology, Inc., Tempe, AZ (US);

Inventors:

Jong Sik Paek, Incheon, KR;

Doo Hyun Park, Anyang-si, KR;

Seong Min Seo, Seoul, KR;

Sung Geun Kang, Bucheon-si, KR;

Yong Song, Seoul, KR;

Wang Gu Lee, Goyang-si, KR;

Eun Young Lee, Gumi-si, KR;

Seo Yeon Ahn, Kwangju-si, KR;

Pil Je Sung, Seoul, KR;

Assignee:

Amkor Technology, Inc., Chandler, AZ (US);

Attorney:

McAndrews, Held & Malloy, Ltd.

Primary Examiner:

Jay C Chang

Assistant Examiner:

Mikka Liu

Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 23/14 (2006.01); H01L 23/498 (2006.01); H01L 21/60 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 23/15 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 23/145 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/49894 (2013.01); H01L 23/147 (2013.01); H01L 23/15 (2013.01); H01L 23/3128 (2013.01); H01L 23/49827 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); H01L 2021/60022 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/92125 (2013.01); H01L 2924/1432 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/18161 (2013.01); H01L 2924/19105 (2013.01);
Abstract

A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide methods for manufacturing a semiconductor device, and semiconductor devices produced thereby, that comprise forming an interposer including a reinforcement layer.

Find Patent Forward Citations

Paek, Jong. (2018). Semiconductor device and manufacturing method thereof (U.S. Patent No. 10079157). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10079157

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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