The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 18, 2018
Filed:
Jul. 08, 2015
Applicant:
Cooler Master Co., Ltd., New Taipei, TW;
Inventors:
Chien-Hung Sun, New Taipei, TW;
Lei-Lei Liu, New Taipei, TW;
Assignee:
COOLER MASTER CO., LTD., New Taipei, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F28F 7/00 (2006.01); F28D 15/02 (2006.01); F28D 15/04 (2006.01); B23K 1/18 (2006.01); B23K 37/06 (2006.01); H01L 23/427 (2006.01);
U.S. Cl.
CPC ...
F28D 15/0275 (2013.01); B23K 1/18 (2013.01); B23K 37/06 (2013.01); F28D 15/0266 (2013.01); F28D 15/04 (2013.01); F28F 2275/06 (2013.01); H01L 23/427 (2013.01);
Abstract
In a three-dimensional heat conducting structure and its manufacturing method, the manufacturing method includes the steps of (a) providing a vapor chamber having at least one insert hole; (b) providing a heat pipe having an open end, and inserting the open end into the insert hole; (c) providing a support ring, and sheathing the support ring on a joint position of the heat pipe and the vapor chamber; and (d) providing a soldering means, and applying the soldering means between the support ring and the heat pipe.