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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10077186 B1

PDFFull Text
Date of Patent:
Sep. 18, 2018

Filed:

May. 23, 2017

Integrated circuit package with sensor and method of making

Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Makoto Shibuya, Beppu, JP;

Luu Nguyen, San Jose, CA (US);

Noboru Nakanishi, Beppu, JP;

Assignee:

TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);

Attorneys:

Rose Alyssa Keagy

Charles A. Brill

Frank D. Cimino

Primary Examiner:

William Harriston

Int. Cl.
CPC ...
B81B 7/00 (2006.01); B81C 1/00 (2006.01); G01N 33/00 (2006.01); H01L 23/16 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
B81B 7/0038 (2013.01); B81C 1/00285 (2013.01); G01N 33/0009 (2013.01); H01L 23/16 (2013.01); B81B 2201/0214 (2013.01); B81B 2203/0338 (2013.01); B81B 2207/098 (2013.01); B81C 2203/0154 (2013.01); H01L 23/3121 (2013.01); H01L 2224/291 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/181 (2013.01); H01L 2924/1815 (2013.01);
Abstract

An integrated circuit ('IC') package comprising an IC die having a top surface and a bottom surface, an elongate member having opposite first and second end portions and a mid portion. The mid portion is positioned proximate the top surface of the IC die. The IC package also includes an encapsulant block having a top surface, a bottom surface and opposite first and second lateral side surfaces. The encapsulant block encapsulates the IC die and the elongate member. Either or both of the first and second end portions of the elongate member are exposed.

Find Patent Forward Citations

Shibuya, Makoto. (2018). Integrated circuit package with sensor and method of making (U.S. Patent No. 10077186). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10077186

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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