The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 18, 2018
Filed:
May. 23, 2017
Applicant:
Texas Instruments Incorporated, Dallas, TX (US);
Inventors:
Assignee:
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Primary Examiner:
Int. Cl.
CPC ...
B81B 7/00 (2006.01); B81C 1/00 (2006.01); G01N 33/00 (2006.01); H01L 23/16 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
B81B 7/0038 (2013.01); B81C 1/00285 (2013.01); G01N 33/0009 (2013.01); H01L 23/16 (2013.01); B81B 2201/0214 (2013.01); B81B 2203/0338 (2013.01); B81B 2207/098 (2013.01); B81C 2203/0154 (2013.01); H01L 23/3121 (2013.01); H01L 2224/291 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/181 (2013.01); H01L 2924/1815 (2013.01);
Abstract
An integrated circuit ('IC') package comprising an IC die having a top surface and a bottom surface, an elongate member having opposite first and second end portions and a mid portion. The mid portion is positioned proximate the top surface of the IC die. The IC package also includes an encapsulant block having a top surface, a bottom surface and opposite first and second lateral side surfaces. The encapsulant block encapsulates the IC die and the elongate member. Either or both of the first and second end portions of the elongate member are exposed.