The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 11, 2018

Filed:

Mar. 13, 2017
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Aycan Erentok, Sunnyvale, CA (US);

John Groff, Santa Clara, CA (US);

Huan-Sheng Hwang, Santa Clara, CA (US);

Paul Beaucourt, Santa Clara, CA (US);

Thomas H. Liu, Santa Clara, CA (US);

Jose R. Camacho Perez, Santa Clara, CA (US);

Brian Girvin, Santa Clara, CA (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 1/3888 (2015.01); H04M 1/04 (2006.01);
U.S. Cl.
CPC ...
H04B 1/3888 (2013.01); H04M 1/04 (2013.01);
Abstract

Example customizable example customizable wearable electronic devices, and methods of assembling the same are disclosed. An example customizable wearable electronic device includes a housing bottom member, a housing top member including a radio frequency (RF) attenuating portion that includes a material that attenuates RF energy and an RF conducting portion that includes an electrically-conductive material, the housing top member separated from the housing bottom member by an electrical isolation gap member, an electrically-conductive contact to couple the RF conducting portion of the top housing member to a communication module in the customizable wearable electronic device, and a customization part selected from a plurality of different customization parts having respective different configurations, the selected customization part electrically coupled to the RF conducting portion of the housing top member when the selected customization part is assembled to the housing top member.


Find Patent Forward Citations

Loading…