The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 11, 2018
Filed:
Mar. 15, 2017
Realtek Semiconductor Corporation, Hsinchu, TW;
REALTEK SEMICONDUCTOR CORPORATION, Hsinchu, TW;
Abstract
The present invention discloses a bonding-wire-type heat sink structure for semiconductor devices. An embodiment of the said bonding-wire-type heat sink structure comprises: a semiconductor substrate; a heat source formed on or included in the semiconductor substrate, said heat source including at least one hot spot; at least one heat conduction layer; at least one heat conductor connecting the at least one hot spot with the at least one heat conduction layer; at least one heat dissipation component in an electrically floating state; and at least one bonding wire connecting the at least one heat conduction layer with the at least one heat dissipation component, so as to transmit the heat of the heat source to the heat dissipation component.